Professional Surface-mounting and Through-hole Soldering Technology.

Professional Surface-mounting and Through-hole Soldering Technology.

SMT nitrogen reflow technology and DIP wave soldering technology.
Various packages like 1206,0805,0603 BGA components SMT technology.
ICT (In Circuit Test), FCT (Functional Circuit Test) Technology.
HDI board placement technology capacity.

PCB Assembly. It refers to the process of assembling and soldering electronic components onto a printed circuit board (PCB) to achieve the final circuit functionality.

PCB Assembly typically involves the following main steps:

Component Procurement: Procuring the required electronic components, including chips, resistors, capacitors, connectors, etc.

Surface Mount Technology (SMT) Placement: Precisely mounting electronic components onto the PCB using surface mount technology (SMT). This involves placing the components in the correct positions and securing them to the PCB using solder paste.

Soldering: Using heat to establish a connection between the electronic components and the solder pads on the printed circuit board. This can be achieved through traditional wave soldering or modern reflow soldering techniques.

Inspection and Testing: Inspecting and testing the assembled PCB to ensure proper component placement and the quality of solder connections. This includes using testing equipment and methods to validate the circuit's functionality and performance.

Final Assembly: In some cases, performing final assembly, may involve installing pins, connectors, or other external interfaces as required.

PCB Assembly is a critical step in combining electronic components with the printed circuit board to form a functional circuit system. It is widely used in various industries, including consumer electronics, communications, automotive, industrial control, and more.